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RT8532GQW Datasheet(PDF) 12 Page - Richtek Technology Corporation |
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RT8532GQW Datasheet(HTML) 12 Page - Richtek Technology Corporation |
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12 / 14 page  12 RT8532 www.richtek.com DS8532-04 January 2014 © Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. Layout Considerations PCB layout is very important to design power switching converter circuits. The following layout guide lines should be strictly followed for best performance of the RT8532. The power components L1, D1, CIN and COUT must be placed as close as possible to reduce the ac current loop. The PCB trace between power components must be short and wide as possible due to large current flow through these trace during operation. Place L1 and D1 as close to LX pins as possible. The trace should be short and wide as possible. Place the input capacitor C1 close to VIN pin. Pin 20 is the compensation point to adjust system stability. Place the compensation components to pin 20 as close as possible. Figure 4. Derating Curve of Maximum Power Dissipation 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 255075 100 125 Ambient Temperature (°C) Four-Layer PCB Thermal Considerations For continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula : PD(MAX) = (TJ(MAX) − TA) / θJA where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and θJAis the junction to ambient thermal resistance. For recommended operating condition specifications, the maximum junction temperature is 125 °C. The junction to ambient thermal resistance, θJA, is layout dependent. For WQFN-20L 3x3 packages, the thermal resistance, θJA, is 68 °C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at TA = 25 °C can be calculated by the following formula : PD(MAX) = (125 °C − 25°C) / (68°C/W) = 1.471W for WQFN-20L 3x3 package The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, θJA. The derating curve in Figure 4 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. |
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