AN1523 APPLICATION NOTE

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Thermal measures

In order to check the reliability of the design, a thermal mapping by means of an IR Camera has been done.

Here below the thermal measures on the board at both nominal input mains voltage at ambient temperature

(25

°C) are shown. The pointers A÷D have been placed across some key components affecting the reliability of

the circuit. The points correspond to the following components:

As shown on the maps, all the other points of the board are within the temperature limits ensuring a reliable

Figure 35. QUASI-PEAK MEASURE

Figure 36. QUASI-PEAK MEASURE

Vin = 115 Vrms - 50 Hz @STAND-BY

Limits: EN55022 CLASS B

Vin = 220 Vrms - 50 Hz @STAND-BY

Limits: EN55022 CLASS B

TESTED POINT

NOTES

A

IC1 - L6590

B

D1 - BZW06–188

Lead length: 13mm each side – Diode mounted 7mm from the

top of PCB surface

C

T1 - TRAFO

Checked the hottest point

D

D4 – BYW98-200

Lead length: 8 mm each side – Diode body placed on PCB

surface

Figure 37. TEMPERATURE IR MEASURE

Figure 38. TEMPERATURE IR MEASURE

Vin = 115 Vrms - 50 Hz @FULL LOAD

Vin = 220 Vrms - 50 Hz @FULL LOAD