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89H32H8G2ZCBL Datasheet(PDF) 2 Page - Renesas Technology Corp |
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89H32H8G2ZCBL Datasheet(HTML) 2 Page - Renesas Technology Corp |
2 / 41 page 2 of 40 November 28, 2011 IDT 89HPES32H8G2 Data Sheet – Configurable presence detect supports card and cable appli- cations – GPE output pin for hot-plug event notification • Enables SCI/SMI generation for legacy operating system support – Hot-swap capable I/O Power Management – Supports D0, D3hot and D3 power management states – Active State Power Management (ASPM) • Supports L0, L0s, L1, L2/L3 Ready and L3 link states • Configurable L0s and L1 entry timers allow performance/ power-savings tuning – Supports PCI Express Power Budgeting Capability – SerDes power savings • Supports low swing / half-swing SerDes operation • SerDes optionally turned-off in D3hot • SerDes associated with unused ports are turned-off • SerDes associated with unused lanes are placed in a low power state 9 General Purpose I/O Reliability, Availability and Serviceability (RAS) – ECRC support – AER on all ports – SECDED ECC protection on all internal RAMs – End-to-end data path parity protection – Checksum Serial EEPROM content protected – Autonomous link reliability (preserves system operation in the presence of faulty links) – Ability to generate an interrupt (INTx or MSI) on link up/down transitions Test and Debug – On-chip link activity and status outputs available for Port 0 (upstream port) – Per port link activity and status outputs available using external I2C I/O expander for all other ports – SerDes test modes – Supports IEEE 1149.6 AC JTAG and IEEE 1149.1 JTAG Power Supplies – Requires only two power supply voltages (1.0 V and 2.5 V) Note that a 3.3V is preferred for VDDI/O – No power sequencing requirements Packaged in a 23mm x 23mm 484-ball Flip Chip BGA with 1mm ball spacing Product Description Utilizing standard PCI Express interconnect, the PES32H8G2 provides the most efficient fan-out solution for applications requiring high throughput, low latency, and simple board layout with a minimum number of board layers. It provides 32 GBps (256 Gbps) of aggregated, full-duplex switching capacity through 32 integrated serial lanes, using proven and robust IDT technology. Each lane provides 5 GT/s of band- width in both directions and is fully compliant with PCI Express Base Specification, Revision 2.0. The PES32H8G2 is based on a flexible and efficient layered archi- tecture. The PCI Express layer consists of SerDes, Physical, Data Link and Transaction layers in compliance with PCI Express Base specifica- tion Revision 2.0. The PES32H8G2 can operate either as a store and forward or cut-through switch. It supports eight Traffic Classes (TCs) and one Virtual Channel (VC) with sophisticated resource management to enable efficient switching and I/O connectivity for servers, storage, and embedded processors with limited connectivity. The PES32H8G2 is a partitionable PCIe switch. This means that in addition to operating as a standard PCI express switch, the PES32H8G2 ports may be partitioned into groups that logically operate as completely independent PCIe switches. Figure 2 illustrates a three partition PES32H8G2 configuration. |
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