DA14530 datasheet(27/333 Pages) RENESAS

Part #	DA14530

Description	Low Power Bluetooth 5.1 SoC

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Manufacturer	RENESAS [Renesas Technology Corp]

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27 / 333 page

DA14530

Low Power Bluetooth 5.1 SoC

Final

Datasheet

Revision 3.4

21-Dec-2021

CFR0011-120-00

27 of 332

Parameter

Description

Conditions

Min

Typ

Max

Unit

ΔfRC/ΔT_1

Temperature dependency

temperature range -40°C to

85°C, RCX_BIAS at

preferred value

-125

125

ppm/d

eg

ΔfRC/ΔT_2

Temperature dependency

temperature range -40°C to

105°C, RCX_BIAS at

preferred value

-200

200

ppm/d

eg

3.6

XTAL32MHz Oscillator

Table 7: XTAL32MHz Oscillator - Recommended Operating Conditions

Parameter

Description

Conditions

Min

Typ

Max

Unit

PDRV_MAX

maximum drive power

Note 1

100

μW

VCLK_EXT

external clock voltage

In case of external clock

source on XTAL32Mp

(XTAL32Mm floating or

connected to mid-level 0.6 V)

0.9

V

φN_EXT_32M

phase noise

fC = 50 kHz; in case of

external clock source

-130

dBc/H

z

ΔfXTAL_TRIM

crystal frequency trim

2

ppm

fXTAL_32M

crystal oscillator frequency

32

MHz

ΔfXTAL

crystal frequency tolerance

After optional trimming;

including aging and

temperature drift

Note 2

-20

20

ppm

ΔfXTAL_UNT

crystal frequency tolerance

Untrimmed; including aging

and temperature drift

Note 3

-40

40

ppm

ESR_1pF

equivalent series resistance

C0<1pF

200

Ω

ESR_3pF

equivalent series resistance

C0<3pF

80

Ω

ESR_5pF

equivalent series resistance

C0<5pF

50

Ω

CL

load capacitance

No external capacitors are

required

4

6

8

pF

Note 1

Select a crystal which can handle a drive level of at least this specification.

Note 2

Using the internal varicaps a wide range of crystals can be trimmed to the required tolerance.

Note 3

Maximum allowed frequency tolerance for compensation by the internal varicap trimming mechanism.

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