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DA14530 Datasheet(PDF) 3 Page - Renesas Technology Corp |
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DA14530 Datasheet(HTML) 3 Page - Renesas Technology Corp |
3 / 333 page DA14530 Low Power Bluetooth 5.1 SoC Final Datasheet Revision 3.4 21-Dec-2021 CFR0011-120-00 3 of 332 © 2021 Renesas Electronics Contents General Description ............................................................................................................................ 1 Key Features ........................................................................................................................................ 1 Applications ......................................................................................................................................... 2 Key Benefits......................................................................................................................................... 2 System Diagram .................................................................................................................................. 2 Contents ............................................................................................................................................... 3 Figures.................................................................................................................................................. 8 Tables ................................................................................................................................................. 10 1 Block Diagram ............................................................................................................................. 18 2 Package and Pinout .................................................................................................................... 20 3 Specifications .............................................................................................................................. 24 3.1 Absolute Maximum Ratings ................................................................................................ 25 3.2 Recommended Operating Conditions................................................................................. 25 3.3 DC Characteristics .............................................................................................................. 25 3.4 Timing Characteristics......................................................................................................... 26 3.5 RCX Oscillator..................................................................................................................... 26 3.6 XTAL32MHz Oscillator........................................................................................................ 27 3.7 XTAL32kHz Oscillator ......................................................................................................... 28 3.8 RC32MHz Oscillator............................................................................................................ 28 3.9 Digital I/O Characteristics.................................................................................................... 28 3.10 Power On Reset.................................................................................................................. 30 3.11 GP ADC .............................................................................................................................. 30 3.12 Temperature Sensor ........................................................................................................... 31 3.13 Radio ................................................................................................................................... 32 4 System Overview......................................................................................................................... 36 4.1 Internal Blocks..................................................................................................................... 36 4.2 Power Management Unit .................................................................................................... 37 4.2.1 Introduction .......................................................................................................... 37 4.2.2 Architecture.......................................................................................................... 37 4.2.2.1 Digital Power Domains .................................................................... 38 4.2.2.2 Power Modes................................................................................... 39 4.2.2.3 VDD Level in Hibernation ................................................................ 41 4.2.2.4 Retainable Registers ....................................................................... 41 4.2.3 Programming ....................................................................................................... 41 4.3 HW FSM (Power-up, Wake-up, and Go-to-Sleep).............................................................. 42 4.3.1 Go-to-Sleep and Refresh Bandgap ..................................................................... 43 4.4 OTP Memory Layout ........................................................................................................... 43 4.4.1 OTP Header......................................................................................................... 44 4.4.2 Configuration Script ............................................................................................. 46 4.5 BootROM Sequence ........................................................................................................... 47 5 Reset............................................................................................................................................. 50 5.1 Introduction ......................................................................................................................... 50 5.2 Architecture ......................................................................................................................... 50 |
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