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CD40105BMS Datasheet(PDF) 10 Page - Renesas Technology Corp

Part # CD40105BMS
Description  CMOS FIFO Register
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

CD40105BMS Datasheet(HTML) 10 Page - Renesas Technology Corp

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FN3353 Rev 0.00
Page 10 of 10
December 1992
CD40105BMS
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
For additional products, see www.intersil.com/en/products.html
© Copyright Intersil Americas LLC 1999. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
Chip Dimensions and Pad Layout
FIGURE 11. EXPANSION, 8-BITS-WIDE-BY-16 N-BITS LONG USING CD40105BMS
SI
D0
D1
D2
D3
Q0
Q1
Q2
Q3
DIR
MR
SO
DOR
SI
D0
D1
D2
D3
Q0
Q1
Q2
Q3
DIR
MR
SO
DOR
SI
D0
D1
D2
D3
Q0
Q1
Q2
Q3
DIR
MR
SO
DOR
SI
D0
D1
D2
D3
Q0
Q1
Q2
Q3
DIR
MR
SO
DOR
SHIFT
IN
DATA OUT
READY
8 BIT
DATA
8 BIT
DATA
SHIFT
OUT
DATA IN
READY
*MASTER
RESET
*Pulse must be applied for cascading by 16 N bits.
Dimensions in parenthesis are in millimeters and are derived from the basic
inch dimensions as indicated. Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11k
Å 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6k
Å, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches


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