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TPA3116D2, TPA3118D2, TPA3130D2

SLOS708G – APRIL 2012 – REVISED DECEMBER 2017

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Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2

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Copyright © 2012–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

ESD Ratings ............................................................ 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 6

6.5

DC Electrical Characteristics .................................... 6

6.6

AC Electrical Characteristics..................................... 7

6.7

Typical Characteristics .............................................. 8

7

Detailed Description ............................................ 13

7.1

Overview ................................................................. 13

7.2

Functional Block Diagram ....................................... 13

7.3

Feature Description................................................. 13

7.4

Device Functional Modes........................................ 24

8

Application and Implementation ........................ 25

8.1

Application Information............................................ 25

8.2

Typical Application .................................................. 25

9

Power Supply Recommendations ...................... 28

10

Layout................................................................... 28

10.1

Layout Guidelines ................................................. 28

10.2

Layout Example .................................................... 29

10.3

Heat Sink Used on the EVM ................................. 31

11

Device and Documentation Support ................. 32

11.1

Related Links ........................................................ 32

11.2

Receiving Notification of Documentation Updates 32

11.3

Community Resources.......................................... 32

11.4

Trademarks ........................................................... 32

11.5

Electrostatic Discharge Caution ............................ 32

11.6

Glossary ................................................................ 32

12

Mechanical, Packaging, and Orderable

Information ........................................................... 32

4 Revision History

Changes from Revision F (February 2017) to Revision G

Page

•

Changed R to GND column row 1 From: "Short" To: "Open" in Table 3 ............................................................................. 16

•

Changed R to GVDD column row 1 From: "Open" To: "Short" in Table 3 ........................................................................... 16

Changes from Revision E (September 2015) to Revision F

Page

•

Changed pin 20 Description From: ceramic cap to OUTPL To: ceramic cap to OUTNL in the Pin Functions table ............. 4

•

Changed pin 24 Description From: ceramic cap to OUTNL To: ceramic cap to OUTPL in the Pin Functions table ............. 4

•

Changed 2.3 Hz To 1.9 Hz for HIGH-PASS FILTER in Table 2 ......................................................................................... 14

Changes from Revision D (January 2015) to Revision E

Page

•

Deleted Package DAP (32) from Part Number TPA3116D2 in the Device Information table ............................................... 1

Changes from Revision C (April 2012) to Revision D

Page

•

Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional

Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

Changes from Revision B (May 2012) to Revision C

Page

•

Changed Notes 2 and 3 of the Thermal Information Table. ................................................................................................... 6

•

Changed the Gain (BTL) Test Condition values for R1 and R2 ............................................................................................. 6

•

Changed the Gain (SLV) Test Condition values for R1 and R2............................................................................................. 6

•

Changed the System Block Diagram.................................................................................................................................... 13