www.ti.com

PACKAGE OUTLINE

C

TYP

8.3

7.9

30X 0.65

32X 0.30

0.19

2X

9.75

(0.15) TYP

0 - 8

0.15

0.05

1.2

1.0

4.36

3.26

4.11

3.31

0.25

GAGE PLANE

0.75

0.50

A

NOTE 3

11.1

10.9

B

6.2

6.0

PowerPAD TSSOP - 1.2 mm max height

DAD0032A

PLASTIC SMALL OUTLINE

4222646/A 12/2015

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MO-153.

PowerPAD is a trademark of Texas Instruments.

TM

1

32

0.1

C A

B

17

16

PIN 1 ID AREA

EXPOSED

THERMAL PAD

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 1.600