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TPA3118D2 Datasheet(PDF) 28 Page - Texas Instruments |
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TPA3118D2 Datasheet(HTML) 28 Page - Texas Instruments |
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28 / 45 page  0.001 0.01 0.1 1 10 0.01 0.1 1 10 40 Output Power (W) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 12V TA = 25°C RL = 4Ω G009 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 Output Power (W) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 24V TA = 25°C RL = 4Ω G010 28 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708G – APRIL 2012 – REVISED DECEMBER 2017 www.ti.com Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated 8.2.3 Application Curves Figure 38. Total Harmonic Distortion + Noise (BTL) vs Output Power Figure 39. Total Harmonic Distortion + Noise (BTL) vs Output Power 9 Power Supply Recommendations The power supply requirements for the TPA3116D2 consist of one higher-voltage supply to power the output stage of the speaker amplifier. Several on-chip regulators are included on the TPA3116D2 to generate the voltages necessary for the internal circuitry of the audio path. It is important to note that the voltage regulators which have been integrated are sized only to provide the current necessary to power the internal circuitry. The external pins are provided only as a connection point for off-chip bypass capacitors to filter the supply. Connecting external circuitry to these regulator outputs may result in reduced performance and damage to the device. The high voltage supply, between 4.5 V and 26 V, supplies the analog circuitry (AVCC) and the power stage (PVCC). The AVCC supply feeds internal LDO including GVDD. This LDO output are connected to external pins for filtering purposes, but should not be connected to external circuits. GVDD LDO output have been sized to provide current necessary for internal functions but not for external loading. 10 Layout 10.1 Layout Guidelines The TPA3116D2 can be used with a small, inexpensive ferrite bead output filter for most applications. However, since the class-D switching edges are fast, it is necessary to take care when planning the layout of the printed circuit board. The following suggestions will help to meet EMC requirements. • Decoupling capacitors — The high-frequency decoupling capacitors should be placed as close to the PVCC and AVCC terminals as possible. Large (100 μF or greater) bulk power supply decoupling capacitors should be placed near the TPA3116D2 on the PVCC supplies. Local, high-frequency bypass capacitors should be placed as close to the PVCC pins as possible. These caps can be connected to the IC GND pad directly for an excellent ground connection. Consider adding a small, good quality low ESR ceramic capacitor between 220 pF and 1 nF and a larger mid-frequency cap of value between 100 nF and 1 µF also of good quality to the PVCC connections at each end of the chip. • Keep the current loop from each of the outputs through the ferrite bead and the small filter cap and back to GND as small and tight as possible. The size of this current loop determines its effectiveness as an antenna. • Grounding — The PVCC decoupling capacitors should connect to GND. All ground should be connected at the IC GND, which should be used as a central ground connection or star ground for the TPA3116D2. • Output filter — The ferrite EMI filter (see Figure 35) should be placed as close to the output terminals as possible for the best EMI performance. The LC filter should be placed close to the outputs. The capacitors used in both the ferrite and LC filters should be grounded. |
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