Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018

LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021

Page 19 of 26

www.murata.com

11 Notice

11.1Storage Conditions

Please use this product within 6 months after receipt.

- The product shall be stored in original under with an ambient temperature from 5 to 35°C, and humidity from 20% to

70%RH. (Packing materials, in particular, may become deformed if the temperature exceeds 40°C.)

- If the product is not used for more than 6months after receipt, confirm the solderability before use.

- Store the product in non-corrosive gas (Cl2, NH3, SO2, NOx, etc.).

- Avoid mechanical shock, such as dropping or puncturing the product, to preserve integrity of the packing materials.

This product is applicable to MSL4 (Based on JEDEC Standard J-STD-020)

- After the package is opened, store it at <30°C / <60%RH and use the product within 72hours.

Please record and manage the time after opening.

- Product should be repacked with desiccating agent immediately after using.

- If the color of the indicator in the packing changes, bake the product before soldering.

Baking condition: 125+5/-0°C, 24hours, 1 time

Baked the product on a heat-resistant tray because other materials (Base Tape, Reel Tape and Cover Tape) are not

heat-resistant.

* For the MSL standard, see IPC/JEDEC J-STD-020 (can be downloaded from www.jedec.org).

If the storage environment is not conducted above standard conditions, it will cause some issue (e.g., Operation issue,

Overcurrent, Malfunction) we shall not be responsible for that.

Before using

please refer to “PRECONDITIONS TO USE MURATA PRODUCTS”

11.2Handling Conditions

Be careful in handling or transporting products because excessive stress or mechanical shock may break products.

Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change.

Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge.

11.3Standard PCB Design (Land Pattern and Dimensions)

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided

between IN and OUT terminals. Please refer to the specifications for the standard land dimensions.

The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary

depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals

and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. If use non-standard

lands, contact Murata beforehand.

11.4Notice for Chip Placer

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking

locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the

maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical

chucking may damage products.