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R1191H144D Datasheet(PDF) 40 Page - Nisshinbo Micro Devices Inc.

Part # R1191H144D
Description  300mA LDO REGULATOR with the Reverse Current Protection
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Manufacturer  NISSHINBO [Nisshinbo Micro Devices Inc.]
Direct Link  https://www.nisshinbo-microdevices.co.jp/en/
Logo NISSHINBO - Nisshinbo Micro Devices Inc.

R1191H144D Datasheet(HTML) 40 Page - Nisshinbo Micro Devices Inc.

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POWER DISSIPATION
SOT-89-5
PD-SOT-89-5-(85125)-JE-A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
φ
0.3 mm × 13 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
2600 mW
Thermal Resistance (θja)
θ
ja = 38°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 13°C/W
θ
ja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
0
500
1000
1500
2000
2500
3000
0
25
50
75
100
125
Ambient Temperature (°C)
2600
85


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