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R1191H144D Datasheet(PDF) 40 Page - Nisshinbo Micro Devices Inc. |
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R1191H144D Datasheet(HTML) 40 Page - Nisshinbo Micro Devices Inc. |
40 / 45 page POWER DISSIPATION SOT-89-5 PD-SOT-89-5-(85125)-JE-A i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes φ 0.3 mm × 13 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 2600 mW Thermal Resistance (θja) θ ja = 38°C/W Thermal Characterization Parameter (ψjt) ψjt = 13°C/W θ ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern 0 500 1000 1500 2000 2500 3000 0 25 50 75 100 125 Ambient Temperature (°C) 2600 85 |
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