R1191H144D datasheet(33/45 Pages) NISSHINBO

Part #	R1191H144D

Description	300mA LDO REGULATOR with the Reverse Current Protection

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Manufacturer	NISSHINBO [Nisshinbo Micro Devices Inc.]

Direct Link	https://www.nisshinbo-microdevices.co.jp/en/

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POWER DISSIPATION

DFN1616-6

PD-DFN1616-6-(85125)-JE-A

i

The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.

The following measurement conditions are based on JEDEC STD. 51-7.

Measurement Conditions

Item

Measurement Conditions

Environment

Mounting on Board (Wind Velocity = 0 m/s)

Board Material

Glass Cloth Epoxy Plastic (Four-Layer Board)

Board Dimensions

76.2 mm × 114.3 mm × 0.8 mm

Copper Ratio

Outer Layer (First Layer): Less than 95% of 50 mm Square

Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square

Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square

Through-holes

φ

0.2 mm × 15 pcs

Measurement Result

(Ta = 25°C, Tjmax = 125°C)

Item

Measurement Result

Power Dissipation

2400 mW

Thermal Resistance (θja)

θ

ja = 41°C/W

Thermal Characterization Parameter (ψjt)

ψjt = 11°C/W

θ

ja: Junction-to-Ambient Thermal Resistance

ψjt: Junction-to-Top Thermal Characterization Parameter

Power Dissipation vs. Ambient Temperature

Measurement Board Pattern

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R1191H144D Datasheet(PDF) 33 Page - Nisshinbo Micro Devices Inc.

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