PACKAGING INFORMATION

Rev. B

02/12/03

Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time

without notice.

ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

Plastic Ball Grid Array

Package Code: B (119-pin)

Notes:

1.Controllingdimension:millimeters,unlessotherwisespecified.

2.BSC=Basicleadspacingbetweencenters.

3.DimensionsD1andEdonotincludemoldflashprotrusionand

shouldbemeasuredfromthebottomofthepackage.

4.Formedleadsshallbeplanarwithrespecttooneanotherwithin

0.004inchesattheseatingplane.

MILLIMETERS

INCHES

Sym.

Min.

Max.

Min.

Max.

N0.

Leads

119

A

—

2.41

—

0.095

A1

0.50

0.70

0.020

0.028

A2

0.80

1.00

0.032

0.039

A3

1.30

1.70

0.051

0.067

A4

0.56 BSC

0.022 BSC

b

0.60

0.90

0.024

0.035

D

21.80

22.20

0.858

0.874

D1

20.32 BSC

0.800 BSC

D2

19.40

19.60

0.764

0.772

E

13.80

14.20

0.543

0.559

E1

7.62 BSC

0.300 BSC

E2

11.90

12.10

0.469

0.476

e

1.27 BSC

0.050 BSC

E1

A1

D1

76543

21

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

E2

E

A2

SEATING PLANE

e

D2

D

A

30

ϒ

A3

A4

φ b (119X)