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HSDL-3200 Datasheet(PDF) 10 Page - Agilent(Hewlett-Packard) |
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HSDL-3200 Datasheet(HTML) 10 Page - Agilent(Hewlett-Packard) |
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10 / 14 page  10 Recommended Metal Solder Stencil Aperture It is recommended that only 0.127 mm (0.005 inches) or 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used: w, the width of aperture is fixed at 0.55 mm (0.022 inches). Aperture opening for shield pad is as per land pattern. Adjacent Land Keepout and Solder Mask Areas Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. “h” is the minimum solder resist strip width required to avoid solder bridging adjacent pads. It is recommended that two fiducial crosses be placed at mid-length of the pads for unit alignment. Note: Wet/Liquid Photo- Imageable solder resist/mask is recommended. Recommended Solder Paste/Cream Volume for Castellation Joints Based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.22 cubic mm (based on either no-clean or aqueous solder cream types with typically 60% to 65% solid content by volume). Using the recommended stencil will result in this volume of solder paste. t, nominal stencil thickness l, length of aperture mm inches mm inches 0.127 0.005 1.75 ± 0.05 0.102 ± 0.002 0.11 0.004 2.4 ± 0.05 0.118 ± 0.002 h Y X m k j DIMENSION mm INCHES h k j m MIN. 0.2 8.2 2.6 3.0 MIN. 0.008 0.323 0.102 0.118 APERTURES AS PER LAND DIMENSIONS l w t |
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Similar Description - HSDL-3200 |
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