Specifications and information are subject to change without notice.
WJ Communications, Inc
• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
June 2003
FP1189
½-Watt HFET
Product Information
The Communications Edge
TM
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an “FP1189”
designator with a four- or five-digit alphanumeric lot
code on the top surface of the package. Tape and reel
specifications for this part is located on the website in
the “Application Notes” section.
ESD / MSL Information
ESD Classification: Class 1B
Value:
Passes at 800 V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Classification: Class IV
Value:
Passes at 2000 V
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating:
Level 3
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC
board in the region where the board contacts the
heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
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