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2002 Oct 09
35
BCcomponents
Product specification
Metallized polypropylene filter capacitors
MKP 416 to 420
Maximum allowed component temperature rise (DT) as a function of the ambient temperature (Tamb)
Heat conductivity (G) as a function of pitch and capacitor body thickness in mW/×C
Table 1
Heat conductivity
Power dissipation and maximum component temperature rise
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a
function of the free air ambient temperature.
The power dissipation can be calculated according chapter “Introduction”, section “Maximum power dissipation”.
The component temperature rise (DT) can be measured (see section “Measuring the component temperature” for more
details) or calculated by
:
•∆T = component temperature rise (°C).
• P = power dissipation of the component (mW).
• G = heat conductivity of the component (mW/°C).
bmax
(mm)
PITCH
(mm)
510
15
3.5
3.0
−−
4.0
−
6.5
−
4.5
4.0
−−
5.0
−
7.5
10
6.0
5.5
9.0
11
7.0
−−
12
8.5
−−
16
10.0
−−
18
Fig.27 Maximum allowed component temperature rise as a function of the ambient temperature.
296x12(full_width)
0
20
40
60
80
100
Tamb (
°C)
CBA850
-60
-40
-20
12
10
8
6
4
2
0
∆T
(
°C)
∆TP G
⁄
=
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