THIS DOCUMENT CONTAINS CONFIDENTIAL AND

PROPRIETARY INFORMATION AND ALL DESIGN,

MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS

AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,

INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE

OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR

REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY

OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS

WRITTEN CONSENT OF SAMTEC, INC.

PROPRIETARY NOTE

*

*

DESIGNED & DIMENSIONED

IN MILLIMETERS[INCHES]

DO NOT

SCALE FROM

THIS PRINT

HDBNC-J-P-XX-ST-EM1

GENDER

-J: JACK

TYPE

-P: PCB

ORIENTATION

-ST: STRAIGHT

TERMINATION

-EM1: EDGE MOUNT .062 BOARD

PLATING SPECIFICATION

-HF: 30µ" GOLD CENTER CONTACT,

3µ" GOLD OUTER CONTACT

-HN: 30µ" GOLD CENTER CONTACT,

100µ" NICKEL OUTER CONTACT

-GF: 10µ" GOLD CENTER CONTACT,

3µ" GOLD OUTER CONTACT

-GN: 10µ" GOLD CENTER CONTACT,

100µ" NICKEL OUTER CONTACT

(SEE TABLE 1)

11.25 .443

REF

17.50 .689

REF

4.75 .187

REF

5.51 .217

REF

4.55 .179

REF

12.75 .502

REF

6.50 .256

REF

"A"

"A"

1/4-36 UNS-2A

REF

0.60

REF

.024

0.43

REF

.017

14.91 .587

REF

(TO SOCKET)

0.76 .030 REF

(TO INSULATOR)

SECTION "A"-"A"

1

2

(SEE NOTE 4)

0.30

(2 PLCS)

.012

REF

1.80

(2 PLCS)

.071

REF

7.50

REF

.295

4.50

REF

.177

5.63

REF

.221

(ON FLAT)

6.25

REF

.246

6.50 .256

5.90 .232

RECOMMENDED MOUNTING HOLE

2.70 [.079] MAX PANEL THICKNESS

4.90 .193

(2 PLCS)

1.91 .075

(2 PLCS)

7.58 .298

0.70 .028

2.30 .091

RECOMMENDED PCB LAYOUT

(SEE NOTE 5 & 6)

EDGE OF PCB

SHEET

OF

UNLESS OTHERWISE SPECIFIED,

DIMENSIONS ARE IN MILLIMETERS.

TOLERANCES ARE:

DECIMALS

ANGLES

X.X: 0.3 [.01]

5

X.XX: 0.13 [.005]

X.XXX: 0.051 [.0020]

MATERIAL:

HD BNC 75 OHM, ST JACK EDGE MOUNT

BY:

HDBNC-J-P-XX-ST-EM1

DWG. NO.

DESCRIPTION:

DO NOT SCALE DRAWING

ALVIN W

02/11/2011

1

1

SHEET SCALE: 4:1

F:\DWG\MISC\MKTG\HDBNC-J-P-XX-ST-EM1 -MKT.SLDDRW

NOTES:

1. C REPRESENTS A CRITICAL DIMENSION.

2. NOTE DELETED.

3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-RF-WI-3040-M.

TRAY: TY-SMA-001-1

COVER: TY-SMA-001-2

4. NUT TO BE PACKAGED SEPARATELY.

5. STENCIL APERTURES TO BE 1:1 WITH THE PCB SURFACE MOUNT PADS.

STENCIL THICKNESS TO BE 0.13 [.005].

6. A FIXTURE IS RECOMMENDED DURING THE REFLOW PROCESS TO HOLD THE CONNECTOR STRAIGHT AND PARALLEL WITH THE PCB.

CONTACT IPG FOR MORE DETAILS.

520 PARK EAST BLVD, NEW ALBANY, IN 47150

PHONE: 812-944-6733

FAX: 812-948-5047

e-Mail info@SAMTEC.com

code 55322

SOCKET: BeCu

SHELL, NUT: BRASS

INSULATOR: PTFE

REVISION E