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TNY253 Datasheet(PDF) 16 Page - Power Integrations, Inc. |
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TNY253 Datasheet(HTML) 16 Page - Power Integrations, Inc. |
16 / 18 page ![]() Rev. F 08/16 16 www.power.com TNY253/254/255 TNY253/254/255 PI-2077-081716 1 A J1 4 L 8 5 C G08A SMD-8 (G Package) D S .004 (.10) J2 -E- -D- B -F- M J3 DIM A B C G H J1 J2 J3 J4 K L M P α Inches 0.356-0.387 0.240-0.260 0.125-0.145 0.004-0.012 0.036-0.044 0.057-0.068 0.048-0.053 0.032-0.037 0.007-0.011 0.010-0.012 0.100 BSC 0.030 (MIN) 0.372-0.388 0-8 ° mm 9.05-9.83 6.10-6.60 3.18-3.68 0.10-0.30 0.91-1.12 1.45-1.73 1.22-1.35 0.81-0.94 0.18-0.28 0.25-0.30 2.54 BSC 0.76 (MIN) 9.45-9.86 0-8 ° Notes: 1. Package dimensions conform to JEDEC specification MS-001-AB (issue B, 7/85) except for lead shape and size. 2. Controlling dimensions are inches. 3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 4. D, E and F are reference datums on the molded body. K G α H .004 (.10) J4 P .010 (.25) M A S .420 .046 .060 .060 .046 .080 Pin 1 .086 .186 .286 Solder Pad Dimensions |
Similar Part No. - TNY253_V01 |
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Similar Description - TNY253_V01 |
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