UDFN6, 1x1, 0.35P

CASE 517BX

ISSUE O

DATE 18 MAY 2011

SCALE 4:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

DIM

MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.13 REF

b

0.12

0.22

D

1.00 BSC

E

1.00 BSC

e

0.35 BSC

L

0.25

0.35

L1

0.30

0.40

A B

E

D

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

A

A1

0.05 C

0.05 C

C SEATING

PLANE

SIDE VIEW

GENERIC

MARKING DIAGRAM*

X = Specific Device Code

M = Date Code

X M

1

2X

2X

A3

BOTTOM VIEW

b

e

6X

0.10

B

0.05

A

C

C

L

5X

NOTE 3

L1

1

3

4

6

M

M

DIMENSIONS: MILLIMETERS

0.22

5X

0.48

6X

1.18

0.53

PITCH

0.35

1

PKG

OUTLINE

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may

or may not be present. Some products may

not follow the Generic Marking.

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

98AON56787E

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

UDFN6, 1x1, 0.35P

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