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OLED-016O002B-LPP5N00000 Datasheet(PDF) 9 Page - Vishay Siliconix |
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OLED-016O002B-LPP5N00000 Datasheet(HTML) 9 Page - Vishay Siliconix |
9 / 14 page ![]() OLED-016O002B-LPP5N00000 www.vishay.com Vishay Revision: 03-Aug-17 9 Document Number: 37794 For technical questions, contact: displays@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 08 Backlight elements 8.1 Illumination source flickers when lit 0.65 8.2 Spots or scratched that appear when lit must be judged. Using OLED spot, lines and contamination standards 2.5 8.3 Backlight does not light or color wrong 0.65 09 Bezel 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination 2.5 9.2 Bezel must comply with job specifications 0.65 10 PCB, COB 10.1 COB seal may not have pinholes larger than 0.2 mm or contamination 2.5 10.2 COB seal surface may not have pinholes through to the IC 2.5 10.3 The height of the COB should not exceed the height indicated in the assembly diagram 0.65 10.4 There may not be more than 2 mm of sealant outside the seal area on the PCB. And there should be no more than three places 2.5 10.5 No oxidation or contamination PCB terminals 2.5 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts 0.65 10.7 The jumper on the PCB should conform to the product characteristic chart 0.65 10.8 If solder gets on bezel tab pads, OLED pad, zebra pad or screw hold pad, make sure it is smoothed down 2.5 11 Soldering 11.1 No un-melted solder paste may be present on the PCB 2.5 11.2 No cold solder joints, missing solder connections, oxidation or icicle 2.5 11.3 No residue or solder balls on PCB 2.5 11.4 No short circuits in components on PCB 0.65 12 General appearance 12.1 No oxidation, contamination, curves or, bends on interface pin (OLB) of TCP 2.5 12.2 No cracks on interface pin (OLB) of TCP 0.65 12.3 No contamination, solder residue or solder balls on product 2.5 12.4 The IC on the TCP may not be damaged, circuits 2.5 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever 2.5 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color 2.5 12.7 Sealant on top of the ITO circuit has not hardened 2.5 12.8 Pin type must match type in specification sheet 0.65 12.9 OLED pin loose or missing pins 0.65 12.10 Product packaging must the same as specified on packaging specification sheet 0.65 12.11 Product dimension and structure must conform to product specification sheet 0.65 INSPECTION SPECIFICATION NO. ITEM CRITERION AQL |
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