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F3L150R07W2H3_B11 Datasheet(PDF) 1 Page - Infineon Technologies AG |
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F3L150R07W2H3_B11 Datasheet(HTML) 1 Page - Infineon Technologies AG |
1 / 22 page EasyPACK™ module with Trench/Fieldstop IGBT H3 and rapid diode and PressFIT / NTC Features • Electrical features - VCES = 650 V - IC nom = 150 A / ICRM = 300 A - Increased blocking voltage capability up to 650 V - Low inductive design - Low switching losses - Low VCE,sat • Mechanical features - Al2O3 substrate with low thermal resistance - Compact design - PressFIT contact technology - Rugged mounting due to integrated mounting clamps Potential applications • Three-level applications • Motor drives • Solar applications • UPS systems Product validation • Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068 Description F3L150R07W2H3_B11 EasyPACK™ module Datasheet Please read the sections "Important notice" and "Warnings" at the end of this document Revision 1.00 www.infineon.com 2021-12-13 |
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