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F3L150R07W2H3_B11 Datasheet(PDF) 3 Page - Infineon Technologies AG

Part # F3L150R07W2H3_B11
Description  EasyPACK??module with Trench/Fieldstop IGBT H3 and rapid diode and PressFIT / NTC
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

F3L150R07W2H3_B11 Datasheet(HTML) 3 Page - Infineon Technologies AG

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1
Package
Table 1
Insulation coordination
Parameter
Symbol Note or test condition
Values
Unit
Isolation test voltage
VISOL
RMS, f = 50 Hz, t = 1 min
3.0
kV
Internal isolation
basic insulation (class 1, IEC 61140)
Al2O3
Creepage distance
dCreep terminal to heatsink
11.5
mm
Creepage distance
dCreep terminal to terminal
6.3
mm
Clearance
dClear
terminal to heatsink
10.0
mm
Clearance
dClear
terminal to terminal
5.0
mm
Comparative tracking index
CTI
>200
Relative thermal index
(electrical)
RTI
housing
140
°C
Table 2
Characteristic values
Parameter
Symbol Note or test condition
Values
Unit
Min.
Typ.
Max.
Stray inductance module
LsCE
15
nH
Module lead resistance,
terminals - chip
RCC'+EE' TH=25°C, per switch
2.8
mΩ
Storage temperature
Tstg
-40
125
°C
Mounting force per clamp
F
40
80
N
Weight
G
39
g
Note:
The current under continuous operation is limited to 25A rms per connector pin
2
IGBT, T1 / T4
Table 3
Maximum rated values
Parameter
Symbol Note or test condition
Values
Unit
Collector-emitter voltage
VCES
Tvj = 25 °C
650
V
Implemented collector
current
ICN
150
A
Continuous DC collector
current
ICDC
Tvj max = 175 °C
TH = 65 °C
85
A
Repetitive peak collector
current
ICRM
tP = 1 ms
300
A
Gate-emitter peak voltage
VGES
±20
V
F3L150R07W2H3_B11
EasyPACKmodule
1 Package
Datasheet
3
Revision 1.00
2021-12-13


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