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TNY278PN Datasheet(PDF) 13 Page - Power Integrations, Inc. |
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TNY278PN Datasheet(HTML) 13 Page - Power Integrations, Inc. |
13 / 24 page 13 TNY274-280 E 2/06 Parameter Symbol Conditions SOURCE = 0 V; T J = -40 to 125 °C See Figure 16 (Unless Otherwise Specified) Min Typ Max Units CONTROL FUNCTIONS Output Frequency in Standard Mode f OSC T J = 25 °C See Figure 4 Average 124 132 140 kHz Peak-Peak Jitter 8 Maximum Duty Cycle DC MAX S1 Open 62 65 % EN/UV Pin Upper Turnoff Threshold Current I DIS -150 -115 -90 µ A EN/UV Pin Voltage V EN I EN/UV = 25 µA 1.8 2.2 2.6 V I EN/UV = -25 µA 0.8 1.2 1.6 DRAIN Supply Current I S1 EN/UV Current > I DIS (MOSFET Not Switching) See Note A 290 µ A I S2 EN/UV Open (MOSFET Switching at f OSC) See Note B TNY274 275 360 µ A TNY275 295 400 TNY276 310 430 TNY277 365 460 TNY278 445 540 TNY279 510 640 TNY280 630 760 ABSOLUTE MAXIMUM RATINGS(1,5) DRAIN Voltage ................................................-0.3 V to 700 V DRAIN Peak Current: TNY274.......................400 (750) mA(2) TNY275.....................560 (1050) mA(2) TNY276.....................720 (1350) mA(2) TNY277.....................880 (1650) mA(2) TNY278...................1040 (1950) mA(2) TNY279 ................. 1200 (2250) mA(2) TNY280 ................. 1360 (2550) mA(2) EN/UV Voltage ................................................... -0.3 V to 9 V EN/UV Current ........................................................... 100 mA BP/M Voltage ......................................................-0.3 V to 9 V Storage Temperature ......................................-65 °C to 150 °C Operating Junction Temperature(3) .................-40 °C to 150 °C Lead Temperature(4) .......................................................260 °C Notes: 1. All voltages referenced to SOURCE, T A = 25 °C. 2. The higher peak DRAIN current is allowed while the DRAIN voltage is simultaneously less than 400 V. 3. Normally limited by internal circuitry. 4. 1/16 in. from case for 5 seconds. 5. Maximum ratings specified may be applied one at a time, without causing permanent damage to the product. Exposure to Absolute Maximum Rating conditions for extended periods of time may affect product reliability. THERMAL IMPEDANCE Thermal Impedance: P or G Package: (θ JA) ........................... 70 °C/W (2) ; 60 °C/W(3) (θ JC) (1) ............................................... 11 °C/W Notes: 1. Measured on the SOURCE pin close to plastic interface. 2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad. 3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad. |
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