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TLE9185QXV33 Datasheet(PDF) 13 Page - Infineon Technologies AG

Part # TLE9185QXV33
Description  BLDC Driver
Download  192 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE9185QXV33 Datasheet(HTML) 13 Page - Infineon Technologies AG

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Datasheet
13
Rev.1.0
2021-01-21
TLE9185QXV33
BLDC Driver
General Product Characteristics
Device Behavior Outside of Specified Functional Range
•28 V < VSINT,func < 40 V: Device will still be functional including the state machine; the specified electrical
characteristics might not be ensured anymore. The VCC1 is working properly, however, a thermal shutdown
might occur due to high power dissipation. The specified SPI communication speed is ensured; the
absolute maximum ratings are not violated, however the device is not intended for continuous operation
of VSINT > 28 V and a thermal shutdown might occur due to high power dissipation. The device operation at
high junction temperatures for long periods might reduce the operating life time.
• VPOR,f < VSINT < 5.5 V (given the fact that the device was powered up correctly before with VSINT > 5.5 V):
Device will still be functional; the specified electrical characteristics might not be ensured anymore:
– A reset could be triggered depending on the Vrthx settings.
– The specified SPI communication speed is ensured.
Note:
VS,UV < VS < 6.0 V: the charge pump might be deactivated due to a charge pump undervoltage
detection, resulting in a turn-off of the external MOSFETs.
4.3
Thermal Resistance
4.4
Current Consumption
Table 3
Thermal Resistance1)
1) Not subject to production test, specified by design.
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min.
Typ.
Max.
Junction to Soldering Point Rth(JSP)
7.2
K/W
Exposed Pad
P_4.3.1
Junction to Ambient
Rth(JA)
–27
K/W
2)
2) Specified Rth(JA)value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board for a power
dissipation of 1.5 W; the product (chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm3 with 2 inner copper layers
(2 x 70 µm Cu, 2 x 35 µm C); where applicable a thermal via array under the exposed pad contacted the first inner
copper layer and 300 mm2 cooling areas on the top layer and bottom layers (70 µm).
P_4.3.2
Table 4
Current Consumption
Current consumption values are specified at Tj = 25°C, VSINT= VS = 13.5 V, all outputs open
(unless otherwise specified)
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min.
Typ.
Max.
Normal Mode
Normal Mode current
consumption
INormal
–4.5
5.5
mA
1) VSINT = 5.5 V to 28 V;
Tj = -40°C to +150°C;
CP=off
P_4.4.37
Stop Mode current
consumption
(low active peak threshold)
IStop_1,25
–50
65
µA
1)2) CSA=off;
WKx=CP=off:
Cyclic Wak.=off
Watchdog = off;
no load on VCC1;
I_PEAK_TH = 0B
P_4.4.38


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