TGA2753-SM

5.9 – 7.1 GHz Power Amplifier

Data Sheet Rev. B, September 2020 | Subject to change without notice

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PCB Mounting Pattern

Notes:

1.

The pad pattern shown has been developed and tested for optimized assembly at Qorvo. The PCB land pattern has been developed to

accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is

recommended.

2.

Ground vias are critical for the proper performance of this device. Vias should have a final plated thru diameter of .1524 mm (.006”).

3.

For best thermal performance, vias under the ground paddle should be copper filled.

RFin

RFout