PRELIMINARY

CG6263AM

38-XXXXX

Page - 4 - of 12

Thermal Resistance[10]

Parameter

Description

Test Conditions

CG6263AM-70

Unit

Min.

Typ.[8]

Max.

Supplay Voltage

2.7

3.3

V

2.4

V

0.4

V

Input HIGH Voltage

0.8*Vcc

+0.3V

V

Input LOW Voltage

-0.3

0.4

V

Input Leakage

Current

–1

+1

µA

Output Leakage

Current

–1

+1

µA

Current

CMOS levels

13

17

mA

f = 1 MHz

2.0

4

mA

Automatic CE

Power-Down

Current — CMOS

Inputs

Only),

f = 0 (OE, WE, BHE and BLE),

Vcc = 3.3V

350

µA

Automatic CE

Power-Down

Current — CMOS

Inputs

Vcc = 3.3V

55

80

µA

Capacitance[10]

Parameter

Description

Test Conditions

Max.

Unit

Input Capacitance

6

pF

Output Capacitance

8

pF

Description

Test Conditions

Symbol

BGA

Unit

Thermal Resistance

(Junction to Ambient)

Still Air, soldered on a 3 × 4.5 inch, two-layer printed

circuit board

Θ

JA

55

°C/W

Thermal Resistance

(Junction to Case)

Θ

JC

16

°C/W

Note:

10. Tested initially and after any design or process changes that may affect these parameters.