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CG6257AM Datasheet(PDF) 2 Page - Weida Semiconductor, Inc. |
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CG6257AM Datasheet(HTML) 2 Page - Weida Semiconductor, Inc. |
2 / 12 page PRELIMINARY CG6257AM 38-XXXXX Page - 2 - of 12 Pin Configuration[2, 3, 4] FBGA Note: 2. DNU pins have to be left floating. 3. Ball H1, G2 and ball H6 for the FBGA package can be used to upgrade to a 8M, 16M and a 32M density respectively. 4. NC “no connect” - not connected internally to the die. WE A11 A10 A6 A0 A3 CE I/O10 I/O8 I/O9 A4 A5 I/O11 I/O13 I/O12 I/O14 I/O15 VSS A9 A8 OE Vss A7 I/O0 BHE NC A17 A2 A1 BLE VCC I/O2 I/O1 I/O3 I/O4 I/O5 I/O6 I/O7 A15 A14 A13 A 12 NC/ NC/ NC/ 3 2 6 5 4 1 D E B A C F G H Top View A16 GND Vcc A20 A19 A18 |
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