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Document Number 71681

03-Mar-06

Vishay Siliconix

AN822

CONCLUSIONS

As a derivative of the PowerPAK SO-8, the PowerPAK

1212-8 uses the same packaging technology and has

been shown to have the same level of thermal perfor-

mance while having a footprint that is more than 40 %

smaller than the standard TSSOP-8.

Recommended PowerPAK 1212-8 land patterns are

provided to aid in PC board layout for designs using this

new package.

The PowerPAK 1212-8 combines small size with attrac-

tive thermal characteristics. By minimizing the thermal

rise above the board temperature, PowerPAK simplifies

thermal design considerations, allows the device to run

handle more current than a same- or larger-size MOS-

FET die in the standard TSSOP-8 or SO-8 packages.

Figure 5. Spreading Copper - Si7401DN

45

55

65

75

85

95

105

0.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

Spreading Copper (sq. in.)

100 %

50 %

0 %

Figure 6. Spreading Copper - Junction-to-Ambient Performance

50

60

70

80

90

100

110

120

130

0.00

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

Spreading Copper (sq. in.)

100 %

0 %

50 %