8. Soldering and Mounting

(1) Soldering

(2) Solder re-flow:

(3) Soldering Iron:

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for

re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air

soldering tools.

Recommended temperature profiles for re-flow soldering in Figure 1.

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that

a soldering iron must be employed the following precautions are recommended.

‧ Preheat circuit and products to 150℃

‧ Never contact the ceramic with the iron tip

‧ Use a 20 watt soldering iron with tip diameter of 1.0mm

‧ 355℃ tip temperature (max)

‧ 1.0mm tip diameter (max)

‧ Limit soldering time to 4~5sec.

Fig.2

SOLDERING

COOLING

NATURAL

PRE-HEATING

within 4~5s

Gradual cooling

350

150

TIME(sec.)

Iron Soldering

Over 60s

Iron Soldering times: 1 times max.

Reflow times: 3 times max.

Fig.1

60~180s

60~150s

217

150

TIME( sec.)

200

25

480s max.

PRE-HEATING

Reflow Soldering

SOLDERING

NATURAL

COOLING

Rev 2.0 :

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LM1265H-Series(G)-D