5. Specification

Part Number

Inductance

L0 (uH)±20%

@ 0 A

I rms (A)

Typ.

I sat (A)

Typ.

DCR

(mΩ) Typ.

@25℃

DCR

(mΩ) Max.

@25℃

Type

LM1265HP-R15MG-D

0.15

55

118

0.49

0.60

non-leadframe

LM1265HP-R22MG-D

0.22

53

112

0.47

0.60

non-leadframe

LM1265HP-R30MG-D

0.30

48

72

0.6

0.72

non-leadframe

LM1265HP-R33MG-D

0.33

46

68

0.65

0.8

non-leadframe

LM1265HP-R36MG-D

0.36

45

66

0.7

0.9

non-leadframe

LM1265HP-R40MG-D

0.40

44

64

0.7

1.0

non-leadframe

LM1265HP-R47MG-D

0.47

41

63

0.9

1.2

non-leadframe

LM1265HP-R50MG-D

0.50

40

60

0.92

1.25

non-leadframe

LM1265HP-R56MG-D

0.56

37

58

1.05

1.2

non-leadframe

LM1265HP-R68MG-D

0.68

35

55

1.25

1.5

non-leadframe

LM1265HP-R82MG-D

0.82

33

50

1.5

1.9

non-leadframe

LM1265HP-1R0MG-D

1.00

30

48

1.7

2.3

non-leadframe

LM1265HP-1R2MG-D

1.20

28

47

1.9

2.4

non-leadframe

LM1265HP-1R5MG-D

1.50

27

45

2.5

3.0

non-leadframe

LM1265HP-1R8MG-D

1.80

24

40

3.6

4.0

leadframe

LM1265HP-2R2MG-D

2.20

22

37

3.8

4.2

leadframe

LM1265HP-2R7MG-D

2.70

20

32

4.3

5.5

leadframe

LM1265HP-3R3MG-D

3.30

18

30

5.7

6.8

leadframe

LM1265HP-4R7MG-D

4.70

13.5

28

7.0

8.4

leadframe

LM1265HP-5R6MG-D

5.60

12.5

23

8.5

10

leadframe

LM1265HP-6R8MG-D

6.80

11.5

18

9.5

11.5

leadframe

LM1265HP-8R2MG-D

8.20

10.5

16

12

15.5

leadframe

LM1265HP-100MG-D

10.0

10.0

15.5

13.2

16.5

leadframe

LM1265HP-130MG-D

13.0

9

13

21

24

leadframe

LM1265HP-150MG-D

15.0

9

13

23.2

28

leadframe

LM1265HP-220MG-D

22.0

9

12

32.5

37

leadframe

LM1265HP-330MG-D

33.0

8

11

48

58

leadframe

LM1265HP-470MG-D

47.0

6.5

9.5

76

90

leadframe

LM1265HP-680MG-D

68.0

4.8

7.8

110

130

leadframe

LM1265HP-101MG-D

100

4.2

5.5

145

165

leadframe

Note:

2. All test data referenced to 25℃ ambient.

3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.

4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δ T of 40℃

6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and

thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

7. Special inquiries besides the above common used types can be met on your requirement.

Rev 2.0 :

www.leiditech.com

12.01.2019

2/6

LM1265H-Series(G)-D