A3I20X050N A3I20X050GN

13

RF Device Data

NXP Semiconductors

PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS

Refer to the following resources to aid your design process.

Application Notes

 AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages

 AN1955: Thermal Measurement Methodology of RF Power Amplifiers

 AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family

 AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family

Engineering Bulletins

 EB212: Using Data Sheet Impedances for RF LDMOS Devices

Software

 Electromigration MTTF Calculator

 RF High Power Model

 .s2p File

Development Tools

 Printed Circuit Boards

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

0

Oct. 2019

 Initial release of data sheet

1

Dec. 2019

 Table 6, Ordering Information: changed tape and reel suffix to R1 to reflect orderable quantity of 500 units,

p. 4

 Package Outline Drawing: OM--400--8 package outline updated to Rev. C, pp. 7–9

2

May 2020

 Wideband Ruggedness table: Ruggedness results were changed based on ISBW. ISBW was split at

120 MHz to differentiate ISBW performance between varying applications, p. 4