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MICROC Datasheet(PDF) 5 Page - ON Semiconductor |
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MICROC Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 16 page ![]() C−Series SiPM Sensors www.onsemi.com 5 GENERAL PARAMETERS Table 2. GENERAL PARAMETERS 1 mm 3 mm 6 mm 10010, 10020, 10035 30020, 30035, 30050 60035 Active area 1 × 1 mm2 3 × 3 mm2 6 × 6 mm2 No. of microcells 10010: 2880 10020: 1296 10035: 504 30020: 10998 30035: 4774 30050: 2668 60035: 18980 Microcell fill factor 10010: 28% 10020: 48% 10035: 64% 30020: 48% 30035: 64% 30050: 72% 60035: 64% Table 3. PACKAGE PARAMETERS 1 mm 3 mm 6 mm 10010, 10020, 10035 30020, 30035, 30050 60035 Package dimensions 1.5 × 1.8 mm2 4 × 4 mm2 7 × 7 mm2 Recommended operating temperature range −40°C to +85°C Maximum storage temperature +105°C Soldering conditions Lead−free, reflow soldering process compatible (MSL 3 for tape & reel quantities; MSL 4 for tape only qty.) See the SMT Handling Tech Note for more details. Encapsulant type Clear transfer molding compound Encapsulant refractive Index 1.59 @ 420 nm Table 4. MAXIMUM CURRENT LEVELS FOR EACH SENSOR SIZE 1 mm 3 mm 6 mm 10010, 10020, 10035 30020, 30035, 30050 60035 6mA 15 mA 20 mA |
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