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TJR1441 Datasheet(PDF) 13 Page - NXP Semiconductors

Part # TJR1441
Description  High-speed CAN transceiver
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

TJR1441 Datasheet(HTML) 13 Page - NXP Semiconductors

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NXP Semiconductors
TJR1441
High-speed CAN transceiver
TJR1441
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Product data sheet
Rev. 1 — 7 September 2020
13 / 31
8 Limiting values
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin GND, unless
otherwise specified.
Symbol
Parameter
Conditions
Min Max
Unit
-0.3
+6
V
on pins VCC, VIO (TJR1441A), TXD, S
(TJR1441A/B), OFF (TJR1441D), S_N
(TJR1441D)
-
+7[2]
on pins CANH, CANL
-36
+40
V
on pins RXD
TJR1441A
-0.3
VIO+0.3[3] V
Vx
voltage on pin x[1]
TJR1441B, TJR1441D
-0.3
VCC+0.3[3] V
V(CANH-CANL) voltage between pin CANH
and pin CANL
-40
+40
V
on pins CANH, CANL
[4]
pulse 1
-100 -
V
pulse 2a
-
+75
V
pulse 3a
-150 -
V
Vtrt
transient voltage
pulse 3b
-
+100
V
IEC 61000-4-2 (150 pF, 330 Ω discharge circuit) [5]
on pins CANH, CANL
-8
+8
kV
Human Body Model (HBM)
on any pin
[6] -4
+4
kV
on pins CANH, CANL
[7] -8
+8
kV
Charged Device Model (CDM)
[8]
on corner pins
-750 +750
V
VESD
electrostatic discharge
voltage
on any other pin
-500 +500
V
Tvj
virtual junction temperature
[9] -40
+175
°C
Tstg
storage temperature
-55
+150
°C
[1]
The device can sustain voltages up to the specified values over the product lifetime, provided applied voltages (including transients) never exceed these
values.
[2]
The device can withstand voltages between 6 V and 7 V for a total of 20 s over the product lifetime.
[3]
Subject to the qualifications detailed in Table notes 1 and 2 above for pins VCC, VIO, TXD, S, OFF, and S_N.
[4]
Verified by an external test house according to IEC TS 62228, Section 4.2.4; parameters for standard pulses defined in ISO7637.
[5]
Verified by an external test house according to IEC TS 62228, Section 4.3.
[6]
According to AEC-Q100-002.
[7]
Pins stressed to reference group containing all ground and supply pins, emulating the application circuits (Figure 11, Figure 12 and Figure 13). HBM pulse
as specified in AEC-Q100-002 used.
[8]
According to AEC-Q100-011.
[9]
In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P # Rth(j-a), where Rth(j-a) is a fixed value used in
the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb).


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