NXP Semiconductors

TJR1441

High-speed CAN transceiver

TJR1441

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© NXP B.V. 2020. All rights reserved.

Product data sheet

Rev. 1 — 7 September 2020

6 / 31

6 Pinning information

6.1 Pinning

TXD

S

GND

CANH

VCC

CANL

RXD

VIO

1

2

3

4

6

5

8

7

aaa-030469

TXD

S

GND

CANH

VCC

CANL

RXD

n.c.

1

2

3

4

6

5

8

7

aaa-030470

TXD

OFF

GND

CANH

VCC

CANL

RXD

S_N

1

2

3

4

6

5

8

7

aaa-030471

TJR1441AT: SO8

TJR1441BT: SO8

TJR1441DT: SO8

RXD 4

VCC 3

GND 2

TXD 1

VIO

5

CANL

6

CANH

7

S

8

aaa-030472

terminal 1

index area

Transparent top view

RXD 4

VCC 3

GND 2

TXD 1

n.c.

5

CANL

6

CANH

7

S

8

aaa-030473

terminal 1

index area

Transparent top view

RXD 4

VCC 3

GND 2

TXD 1

S_N

5

CANL

6

CANH

7

OFF

8

aaa-030474

terminal 1

index area

Transparent top view

TJR1441ATK: HVSON8

TJR1441BTK: HVSON8

TJR1441DTK: HVSON8

Figure 3. Pin configuration diagrams

6.2 Pin description

Table 3. Pin description

Symbol

Pin

Type[1] Description

TXD

1

I

transmit data input; inputs data (from the CAN controller) to be written to the bus lines

GND[2]

2

G

ground

VCC

3

P

5 V supply voltage input

RXD

4

O

receive data output; outputs data read from the bus lines (to the CAN controller).

VIO

P

supply voltage input for I/O level adapter in TJR1441A

n.c.

-

not connected in TJR1441B

S_N

5

I

Silent mode control input in TJR1441D; active-LOW

CANL

6

AIO

LOW-level CAN bus line

CANH

7

AIO

HIGH-level CAN bus line

S

I

Silent mode control input in TJR1441A and TJR1441B; active-HIGH

OFF

8

I

Off mode control input in TJR1441D; active-HIGH

[1]

I: digital input; O: digital output; AIO: analog input/output; P: power supply; G: ground.

[2]

HVSON package die supply ground is connected to both the GND pin and the exposed center pad. The GND pin must be soldered to board ground. For

enhanced thermal and electrical performance, it is also recommended to solder the exposed center pad to board ground.