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TJR1441 Datasheet(PDF) 31 Page - NXP Semiconductors |
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TJR1441 Datasheet(HTML) 31 Page - NXP Semiconductors |
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31 / 31 page  NXP Semiconductors TJR1441 High-speed CAN transceiver Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2020. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 September 2020 Document identifier: TJR1441 Contents 1 General description ............................................ 1 1.1 TJR1441 variants .............................................. 1 2 Features and benefits .........................................1 2.1 General .............................................................. 1 2.2 Predictable and fail-safe behavior ..................... 2 2.3 Protection ...........................................................2 3 Quick reference data .......................................... 3 4 Ordering information .......................................... 4 5 Block diagrams ................................................... 4 6 Pinning information ............................................ 6 6.1 Pinning ...............................................................6 6.2 Pin description ................................................... 6 7 Functional description ........................................7 7.1 Operating modes ............................................... 7 7.1.1 Off mode ............................................................9 7.1.2 Silent mode ........................................................9 7.1.3 Normal mode ..................................................... 9 7.1.4 Controlled Off mode (TJR1441D) ....................10 7.1.5 Operating modes and gap-free operation ........ 10 7.2 Fail-safe features .............................................11 7.2.1 TXD dominant time-out function ...................... 11 7.2.2 Internal biasing of TXD and mode input pins ....11 7.2.3 Undervoltage detection on pins VCC and VIO ...................................................................12 7.2.4 Overtemperature protection .............................12 7.2.5 I/O levels ..........................................................12 8 Limiting values ..................................................13 9 Thermal characteristics ....................................14 10 Static characteristics ........................................14 11 Dynamic characteristics ...................................17 12 Application information ....................................19 12.1 Application diagrams ....................................... 19 12.2 Application hints .............................................. 20 13 Test information ................................................21 13.1 Quality information ...........................................21 14 Package outline .................................................22 15 Handling information ........................................ 24 16 Soldering of SMD packages .............................24 16.1 Introduction to soldering ............................. 16.2 Wave and reflow soldering ......................... 16.3 Wave soldering ........................................... 16.4 Reflow soldering ......................................... 17 Soldering of HVSON packages ........................26 18 Appendix: ISO 11898-2:2016 parameter cross-reference list ...........................................27 19 Legal information ..............................................29 |
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