TJR1441 datasheet(26/31 Pages) NXP

26 / 31 page

NXP Semiconductors

TJR1441

High-speed CAN transceiver

TJR1441

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Product data sheet

Rev. 1 — 7 September 2020

26 / 31

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

MSL: Moisture Sensitivity Level

Figure 18. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

17 Soldering of HVSON packages

Section 16 contains a brief introduction to the techniques most commonly used to solder

Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON

leadless package ICs can be found in the following application note:

• AN10365 “Surface mount reflow soldering description”

Similar Part No. - TJR1441

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NXP Semiconductors	TJR1442	358Kb / 30P	High-speed CAN transceiver with Standby mode
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