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W25Q16JVSSIQ Datasheet(PDF) 20 Page - Winbond

Part # W25Q16JVSSIQ
Description  3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W25Q16JVSSIQ Datasheet(HTML) 20 Page - Winbond

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W25Q16JV
- 19 -
9.
INSTRUCTIONS
The Standard/Dual/Quad SPI instruction set of the W25Q16JV consists of 48 basic instructions that are
fully controlled through the SPI bus (see Instruction Set Table1-2). Instructions are initiated with the falling
edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the instruction code.
Data on the DI input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in Figures 5 through
57. All read instructions can be completed after any clocked bit. However, all instructions that Write,
Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been clocked)
otherwise the instruction will be ignored. This feature further protects the device from inadvertent writes.
Additionally, while the memory is being programmed or erased, or when the Status Register is being written,
all instructions except for Read Status Register will be ignored until the program or erase cycle has
completed.
9.1
Device ID and Instruction Set Tables
Manufacturer and Device Identification
MANUFACTURER ID
(MF7 - MF0)
Winbond Serial Flash
EFh
Device ID
(ID7 - ID0)
(ID15 - ID0)
Instruction
ABh, 90h, 92h, 94h
9Fh
W25Q16JV-IQ/JQ
14h
4015h
W25Q16JV-IM*/JM*
14h
7015h
Note: For DTR, QPI supporting, please refer to W25Q16JV DTR datasheet.


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