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W25Q16JVSSIQ Datasheet(PDF) 74 Page - Winbond |
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W25Q16JVSSIQ Datasheet(HTML) 74 Page - Winbond |
74 / 75 page W25Q16JV - 73 - W25Q16JV-IM/JM(5) valid part numbers: W25Q16JV-IM DENSITY PRODUCT NUMBER TOP SIDE MARKING SN SOIC-8 150-mil 16M-bit W25Q16JVSNIM 25Q16JVNIM SS SOIC-8 208-mil 16M-bit W25Q16JVSSIM 25Q16JVSIM UX(2) USON-8 2x3x0.6(max.)mm³ 16M-bit W25Q16JVUXIM 1Pyww(3) 0Mxxxx UU USON-8 4x3mm 16M-bit W25Q16JVUUIM Q16JVUUIM ZP WSON-8 6x5-mm 16M-bit W25Q16JVZPIM 25Q16JVIM W25Q16JV-JM DENSITY PRODUCT NUMBER TOP SIDE MARKING SN SOIC-8 150-mil 16M-bit W25Q16JVSNJM 25Q16JVNJM SS SOIC-8 208-mil 16M-bit W25Q16JVSSJM 25Q16JVSJM UX(2) USON-8 2x3x0.6(max.)mm³ 16M-bit W25Q16JVUXJM 1PywJ(3) 0Mxxxx UU USON-8 4x3mm 16M-bit W25Q16JVUUJM Q16JVUUJM ZP WSON-8 6x5-mm 16M-bit W25Q16JVZPJM 25Q16JVJM Note: 1. These package types are special order, please contact Winbond for more information. 2. USON has special top side marking due to size limitation yww = date code (year, work week); xxxx = lot ID 3. WLCSP package type BY has special top marking due to size limitation. 4. “yw” is date code 5. For DTR, QPI supporting, please refer to W25Q16JV DTR datasheet. |
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