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W25Q16JVSSIQ Datasheet(PDF) 71 Page - Winbond |
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W25Q16JVSSIQ Datasheet(HTML) 71 Page - Winbond |
71 / 75 page W25Q16JV Publication Release Date: March 22, 2018, 2018 - 70 - Revision G 11.8 8-Ball WLCSP (Package Code BY) Symbol Millimeters Inches Min Nom Max Min Nom Max A 0.388 0.432 0.476 0.0153 0.0170 0.0187 A1 0.108 0.127 0.146 0.0043 0.0050 0.0057 D1 --- 0.529 --- --- 0.0208 --- E1 --- 0.302 --- --- 0.0119 --- eD --- 0.400 --- --- 0.0157 --- eE --- 0.400 --- --- 0.0157 --- b 0.200 0.250 0.300 0.0079 0.0098 0.0118 aaa 0.100 0.0040 bbb 0.100 0.0040 ccc 0.030 0.0012 ddd 0.150 0.0060 Notes: 1. Dimension b is measured at the maximum solder bump diameter, parallel to primary datum C. 2. Dimension D and E; please contact Winbond for details. |
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