W25Q16JVSSIQ datasheet(68/75 Pages) WINBOND

Part #	W25Q16JVSSIQ

Description	3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI

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Manufacturer	WINBOND [Winbond]

Direct Link	http://www.winbond.com

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68 / 75 page

W25Q16JV

- 67 -

11.5 8-Pad WSON 6x5-mm (Package Code ZP)

Symbol

Millimeters

Inches

Min

Nom

Max

Min

Nom

Max

A

0.70

0.75

0.80

0.028

0.030

0.031

A1

0.00

0.02

0.05

0.000

0.001

0.002

b

0.35

0.40

0.48

0.014

0.016

0.019

C

---

0.20 REF

---

0.008 REF

---

D

5.90

6.00

6.10

0.232

0.236

0.240

D2

3.35

3.40

3.45

0.132

0.134

0.136

E

4.90

5.00

5.10

0.193

0.197

0.201

E2

4.25

4.30

4.35

0.167

0.169

0.171

e

1.27 BSC

0.050 BSC

L

0.55

0.60

0.65

0.022

0.024

0.026

y

0.00

---

0.075

0.000

---

0.003

Note:

The metal pad area on the bottom center of the package is not connected to any internal electrical signals. It can be

left floating or connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad.

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W25Q16JVSSIQ Datasheet(PDF) 68 Page - Winbond

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