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W25Q16JVSSIQ Datasheet(PDF) 65 Page - Winbond |
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W25Q16JVSSIQ Datasheet(HTML) 65 Page - Winbond |
65 / 75 page W25Q16JV Publication Release Date: March 22, 2018, 2018 - 64 - Revision G 11. PACKAGE SPECIFICATIONS 11.1 8-Pin SOIC 150-mil (Package Code SN) 20131227 Symbol Millimeters Inches Min Mon Max Min Mon Max A 1.35 1.60 1.75 0.053 0.062 0.069 A1 0.10 0.15 0.25 0.004 0.006 0.010 b 0.33 0.41 0.51 0.013 0.016 0.020 C 0.19 0.20 0.25 0.0075 0.0078 0.0098 D 4.80 4.85 5.00 0.188 0.190 0.197 E 3.80 3.90 4.00 0.150 0.153 0.157 HE 5.80 6.00 6.20 0.228 0.236 0.244 e 1.27 BSC 0.050 BSC L 0.40 0.71 1.27 0.016 0.027 0.050 Y --- --- 0.10 --- --- 0.004 θ 0° --- 10° 0° --- 10° |
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