W25Q16JVSSIQ datasheet(65/75 Pages) WINBOND

Part #	W25Q16JVSSIQ

Description	3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI

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Manufacturer	WINBOND [Winbond]

Direct Link	http://www.winbond.com

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W25Q16JV

Publication Release Date: March 22, 2018, 2018

- 64 -

Revision G

11. PACKAGE SPECIFICATIONS

11.1 8-Pin SOIC 150-mil (Package Code SN) 20131227

Symbol

Millimeters

Inches

Min

Mon

Max

Min

Mon

Max

A

1.35

1.60

1.75

0.053

0.062

0.069

A1

0.10

0.15

0.25

0.004

0.006

0.010

b

0.33

0.41

0.51

0.013

0.016

0.020

C

0.19

0.20

0.25

0.0075

0.0078

0.0098

D

4.80

4.85

5.00

0.188

0.190

0.197

E

3.80

3.90

4.00

0.150

0.153

0.157

HE

5.80

6.00

6.20

0.228

0.236

0.244

e

1.27 BSC

0.050 BSC

L

0.40

0.71

1.27

0.016

0.027

0.050

Y

---

0.10

---

0.004

θ

0°

---

10°

0°

---

10°

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W25Q16JVSSIQ Datasheet(PDF) 65 Page - Winbond

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