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W25Q16JVSSIQ Datasheet(PDF) 6 Page - Winbond |
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W25Q16JVSSIQ Datasheet(HTML) 6 Page - Winbond |
6 / 75 page W25Q16JV - 5 - 3. PACKAGE TYPES AND PIN CONFIGURATIONS 3.1 Pin Configuration SOIC 150/208-mil Figure 1a. Pin Assignments, 8-pin SOIC150-mil/208-mil (Package Code SN, SS) 3.2 Pad Configuration WSON 6x5-mm & USON 2x3-mm/4x3-mm, XSON 4x4-mm Figure 1b. Pad Assignments, 8-pad WSON 6x5-mm, USON 2X3-mm/4x3-mm, XSON 4x4-mm (Package Code ZP, UX, UU, XG) 3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, USON 2x3-mm/4x3-mm, XSON 4x4-mm PIN NO. PIN NAME I/O FUNCTION 1 /CS I Chip Select Input 2 DO (IO1) I/O Data Output (Data Input Output 1)(1) 3 /WP (IO2) I/O Write Protect Input ( Data Input Output 2)(2) 4 GND Ground 5 DI (IO0) I/O Data Input (Data Input Output 0)(1) 6 CLK I Serial Clock Input 7 /HOLD or /RESET (IO3) I/O Hold or Reset Input (Data Input Output 3)(2) 8 VCC Power Supply Notes: 1. IO0 and IO1 are used for Standard and Dual SPI instructions 2. IO0 – IO3 are used for Quad SPI instructions, /HOLD (or /RESET) function is only available for Standard/Dual SPI. 1 2 3 4 8 7 6 5 /CS DO (IO1) /WP (IO2) GND VCC /HOLD or /RESET (IO3) DI (IO0) CLK Top View 1 2 3 4 /CS DO (IO1) /WP (IO2) GND VCC /HOLD or /RESET (IO3) DI (IO0) CLK Top View 8 7 6 5 |
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