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W25Q16JVSSIQ Datasheet(PDF) 5 Page - Winbond

Part # W25Q16JVSSIQ
Description  3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W25Q16JVSSIQ Datasheet(HTML) 5 Page - Winbond

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W25Q16JV
Publication Release Date: March 22, 2018, 2018
- 4 -
Revision G
1. GENERAL DESCRIPTIONS
The W25Q16JV (16M-bit) Serial Flash memory provides a storage solution for systems with limited space,
pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.
They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing
voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption
as low as 1µA for power-down.
The W25Q16JV array is organized into 8,192 programmable pages of 256-bytes each. Up to 256 bytes can
be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB
block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W 25Q16JV has 512
erasable sectors and 32 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in
applications that require data and parameter storage. (See figure 2.)
The W25Q16JV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad
output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2, and
I/O3. SPI clock frequencies of up to 133MHz are supported allowing equivalent clock rates of 266MHz
(133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad
I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash
memories.
Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64-
bit Unique Serial Number and three 256-bytes Security Registers.
2. FEATURES
 New Family of SpiFlash Memories
– W25Q16JV: 16M-bit / 2M-byte (2,097,152)
– Standard SPI: CLK, /CS, DI, DO
– Dual SPI: CLK, /CS, IO0, IO1
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– Software & Hardware Reset(1)
 Highest Performance Serial Flash
– 133MHz Single, Dual/Quad SPI clocks
– 266/532MHz equivalent Dual/Quad SPI
– 66MB/S continuous data transfer rate
– Min. 100K Program-Erase cycles per sector
– More than 20-year data retention
 Efficient “Continuous Read”
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
 Low Power, Wide Temperature Range
– Single 2.7V to 3.6V supply
– -40°C to +85°C operating range
– -40°C to +105°C operating range
– <1µA Power-down (typ.)
 Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
 Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down and
– Special OTP protection(2)
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
 Space Efficient Packaging
– 8-pin SOIC 150-mil / 208-mil
– 8-pad USON 2X3mm/4x3-mm
– 8-pad XSON 4x4-mm
– 8-pad WSON 6x5-mm
– 8-ball WLCSP
– Contact Winbond for KGD and other options
Note: 1. Hardware /RESET pin is only available on SOIC-16 & TFBGA packages
2. Please contact Winbond for details.


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