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W25Q16JVSSIQ Datasheet(PDF) 43 Page - Winbond

Part # W25Q16JVSSIQ
Description  3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W25Q16JVSSIQ Datasheet(HTML) 43 Page - Winbond

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W25Q16JV
Publication Release Date: March 22, 2018, 2018
- 42 -
Revision G
Release Power-down / Device ID (ABh)
The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to
release the device from the power-down state, or obtain the devices electronic identification (ID) number.
To release the device from the power-down state, the instruction is issued by driving the /CS pin low, shifting
the instruction code “ABh” and driving /CS high as shown in Figure 38a. Release from power-down will take
the time duration of tRES1 (See AC Characteristics) before the device will resume normal operation and
other instructions are accepted. The /CS pin must remain high during the tRES1 time duration.
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by
driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The Device ID
bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first. The Device ID value
for the W25Q16JV is listed in Manufacturer and Device Identification table. The Device ID can be read
continuously. The instruction is completed by driving /CS high.
When used to release the device from the power-down state and obtain the Device ID, the instruction is the
same as previously described, and shown in Figure 38b, except that after /CS is driven high it must remain
high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will resume
normal operation and other instructions will be accepted. If the Release from Power-down / Device ID
instruction is issued while an Erase, Program or Write cycle is in process (when BUSY equals 1) the
instruction is ignored and will not have any effects on the current cycle.
Figure 38a. Release Power-down Instruction
Figure 38c. Release Power-down / Device ID Instruction
/CS
CLK
DI
(IO
0)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (ABh)
Mode 0
Mode 3
tRES1
Power-down current
Stand-by current
tRES2
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (ABh)
High Impedance
8
9
29
30
31
3 Dummy Bytes
23
22
2
1
0
*
Mode 0
Mode 3
7
6
5
4
3
2
1
0
*
32
33
34
35
36
37
38
Device ID
Power-down current
Stand-by current
= MSB
*


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