W25Q16JVSSIQ datasheet(31/75 Pages) WINBOND

Part #	W25Q16JVSSIQ

Description	3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI

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Manufacturer	WINBOND [Winbond]

Direct Link	http://www.winbond.com

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W25Q16JV

Publication Release Date: March 22, 2018, 2018

- 30 -

Revision G

Fast Read Dual I/O (BBh)

The Fast Read Dual I/O (BBh) instruction allows for improved random access while maintaining two IO

pins, IO0 and IO1. It is similar to the Fast Read Dual Output (3Bh) instruction but with the capability to input

the Address bits (A23-0) two bits per clock. This reduced instruction overhead may allow for code execution

(XIP) directly from the Dual SPI in some applications.

Figure 22. Fast Read Dual I/O Instruction (M7-M0 should be set to Fxh)

/CS

CLK

DI

(IO

0)

DO

(IO

1)

Mode 0

Mode 3

0

1

2

3

4

5

6

7

Instruction (BBh)

8

9

10

12

13

14

24

25

26

27

28

29

30

31

6

4

2

0

*

23

/CS

CLK

DI

(IO

0)

DO

(IO

1)

0

32

33

34

35

36

37

38

39

7

5

3

1

*

6

4

2

0

7

5

3

1

6

4

2

0

7

5

3

1

6

4

2

0

7

5

3

1

*

IOs switch from

Input to Output

6

7

22

20

18

16

23

21

19

17

14

12

10

8

15

13

11

9

6

4

2

0

7

5

3

1

6

4

2

0

7

5

3

1

11

15

16

17

18

20

21

22

19

23

1

A23-16

A15-8

A7-0

M7-0

Byte 1

Byte 2

Byte 3

Byte 4

= MSB

*

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