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LP8866S-Q1 Datasheet(PDF) 81 Page - Texas Instruments |
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LP8866S-Q1 Datasheet(HTML) 81 Page - Texas Instruments |
81 / 82 page www.ti.com EXAMPLE STENCIL DESIGN 38X (1.5) 38X (0.3) 36X (0.5) (5.8) (R0.05) TYP (4.7) BASED ON 0.125 THICK STENCIL (2.9) BASED ON 0.125 THICK STENCIL PowerPAD TSSOP - 1.2 mm max height DCP0038A SMALL OUTLINE PACKAGE 4218816/A 10/2018 2.45 X 3.97 0.175 2.65 X 4.29 0.15 2.90 X 4.70 (SHOWN) 0.125 3.24 X 5.25 0.1 SOLDER STENCIL OPENING STENCIL THICKNESS NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. TM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 8X SYMM SYMM 1 19 20 38 METAL COVERED BY SOLDER MASK SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES 39 |
Similar Part No. - LP8866S-Q1_V01 |
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Similar Description - LP8866S-Q1_V01 |
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