Electronic Components Datasheet Search |
|
LP8866S-Q1 Datasheet(PDF) 79 Page - Texas Instruments |
|
LP8866S-Q1 Datasheet(HTML) 79 Page - Texas Instruments |
79 / 82 page www.ti.com PACKAGE OUTLINE C 36X 0.5 2X 9 38X 0.27 0.17 6.6 6.2 TYP SEATING PLANE 0.15 0.05 0.25 GAGE PLANE 0 -8 1.2 MAX 2X 0.95 MAX NOTE 5 2X 0.95 MAX NOTE 5 4.70 3.94 2.90 2.43 B 4.5 4.3 A 9.8 9.6 NOTE 3 0.75 0.50 (0.15) TYP PowerPAD TSSOP - 1.2 mm max height DCP0038A SMALL OUTLINE PACKAGE 4218816/A 10/2018 1 19 20 38 0.08 C A B PIN 1 INDEX AREA SEE DETAIL A 0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MO-153. 5. Features may differ or may not be present. TM PowerPAD is a trademark of Texas Instruments. A 20 DETAIL A TYPICAL SCALE 2.000 THERMAL PAD 1 19 20 38 39 |
Similar Part No. - LP8866S-Q1_V01 |
|
Similar Description - LP8866S-Q1_V01 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |