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LP8866S-Q1 Datasheet(PDF) 7 Page - Texas Instruments |
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LP8866S-Q1 Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 82 page  6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) (2) MIN MAX UNIT Voltage on pins VSENSE_N, SD, UVLO -0.3 VSENSE _P + 0.3 V Voltage on pins VSENSE_P, FB, DISCHARGE, OUT1 to OUT6 –0.3 52 V C1N, C1P, VDD, EN, ISNS, ISNS_GND, INT, MODE, PWM_FSET, BST_FSET, LED_SET, ISET, GD and CPUMP –0.3 6 V Voltage on pins PWM, BST_SYNC, SDA, SCL –0.3 VDD + 0.3 V Continuous power dissipation(3) Internally Limited W Thermal Ambient temperature, TA(4) –40 125 Junction temperature, TJ(4) –40 150 °C Lead temperature (soldering) 260 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pins. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 165°C (typical) and disengages at TJ = 150°C (typical). (4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX = 150°C), the power dissipation of the device in the application (P), the junction-to-board thermal resistance and the temperature difference between the system board and the ambient (ΔtBA), which is given by the following equation: TA-MAX = TJ-MAX – (ΘJB × P) - ΔtBA. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V Charged device model (CDM), per AEC Q100-011 Corner pins (1, 19, 20 and 38) ±750 Other pins ±500 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted)(1) MIN NOM MAX UNIT Voltage on pins VSENSE_P, VSENSE_N, SD, UVLO 3 12 48 V FB, OUT1 to OUT6 0 48 ISNS, ISNSGND 0 5.5 EN, PWM, INT, SDA, SCL, BST_SYNC 0 3.3 5.5 VDD 3 3.3/5 5.5 C1N, C1P, CPUMP,GD 0 5 5.5 Thermal Ambient temperature, TA –40 125 °C (1) All voltages are with respect to the potential at the GND pins. www.ti.com LP8866S-Q1 SNVSBD1A – AUGUST 2020 – REVISED FEBRUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: LP8866S-Q1 |
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