arrayj-300xx-64p-pcb datasheet(9/32 Pages) ONSEMI

Part #	ARRAYJ-300XX-64P-PCB

Description	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays

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Manufacturer	ONSEMI [ON Semiconductor]

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ArrayJ Series

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ARRAYJ−60035−4P−BGA (2 X 2 Array of 6 mm Pixels)

Array Size

Sensor Type

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

2 x 2

60035

Pixel

12.64 x 12.64 mm2

6.33 mm

9

3 x 3 BGA

The ARRAYJ−60035−4P is comprised of 4 individual

6mm J−Series sensors arranged in a 2 x 2 array.

The performance of the individual pixels and details of the

bias to apply can be found in the J−Series datasheet.

Connections to each sensor are provided by a BGA (ball

grid array). The BGA can be reflow soldered onto the user’s

own readout board.

The 4 SiPM sensors have all substrate connections

(cathodes) connected together to form a common I/O. The

3 x 3 BGA provides connections as follows:

• 4 x standard I/O

• 5 x common I/O

• There is NO fast output

ARRAYJ−60035−4P−BGA Board Dimensions and Pin Location

A

B

C

3

2

1

The complete ARRAYJ−60035−4P−BGA CAD and solder footrprint is available to download.

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ARRAYJ-300XX-64P-PCB Datasheet(PDF) 9 Page - ON Semiconductor

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