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ARRAYJ-300XX-64P-PCB Datasheet(PDF) 28 Page - ON Semiconductor |
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ARRAYJ-300XX-64P-PCB Datasheet(HTML) 28 Page - ON Semiconductor |
28 / 32 page ![]() ArrayJ Series www.onsemi.com 28 Figure 15. Schematic of the 4−pin header and balun transformer SG JX Fin Fout I O SG SG SG = Local signal ground Each SMT/Balun/4 Way Header circuits has its own local signal ground SMA Output RFMD RFXF9503 EMI Considerations It has been shown that the EMI (Electromagnetic Interference) can be picked up on the unshielded wires on the BOB. It is recommended that customers who experience excessive EMI seek to reduce the EMI in their lab, ideally at the EMI source. If this is not possible then improved shielding should be used. In all cases, testing of the SiPM sensor should be performed in total darkness. For a system design, it is recommended that the customer consider shielding of all lines. The readout requirements for a SiPM are similar to that of a PMT and similar care should be taken with both sensor types. In comparison to an APD which has significantly lower gain than a SiPM, the SiPM will provide much improved resistance to EMI due to the higher gain of the SiPM sensor. |
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